Logic Design for Array-Based Circuits

Copyright © 1996, 2001, 2002, 2008, 2016 Donnamaie E. White , WhitePubs Enterprises, Inc.

• Table of Contents
  
• Preface
  
• Overview
  
• Chapter 1 Introduction
• Chapter 2 Structured Design Methodology
  
• Chapter 3 Sizing the Design
  • Functional Specification - A Closer Look
  • Review the Available Arrays
  • Architectual Specification or Hardware Specification
  • Array Sizing
  • Cell Capabilities
  • Array Architecture
  • Netlist
  • Example: AMCC Interface Options
  • Example - AMCC Arrays - Power Supply Options
  • Interface Cell Functionality
  • Examples
  • Internal Cell Functionality
  • Multi-Cell Macros
  • Hard and soft macros
  • Refining Interface Requirements
  • Adding Extra Power and Ground Macros
  • Dual-Function I/O Macros
  • Example - Simultaneously Switching Outputs
  • Thermal Diodes
  • The AMCC Speed Monitor
  • Final Interface Cell Utilization
  • Drivers
  • Exercises
• Chapter 3 Appendix = Case Study in Sizing a Design
• Chapter 4 Design Optimization
• Chapter 5 Timing Analysis for Arrays
• Chapter 6 External Set-up and Hold Times
• Chapter 7 Power Considerations
• Case Study: DC Power Computation
• Case Study: AC Power Computation
• Chapter 8 Simulation
• Case Study: Simulationest
• Chapter 9 Faults and Fault Detectiond Output
• Chapter 10 Design Submission
• ASIC Glossary
  • Glossary A-D
  • Glossary E-K
  • Glossary L-R
  • Glossary S-Z
  • Symbols

Sizing the Design - Selecting the Array

Functional Specification - A Closer Look

The functional or target specification is the first level of description of the project that may encompass one or more arrays when the design is partitioned. There may be a specification tree with the total project at the top node and individual circuit blocks or modules detailed underneath. Topics included in a functional specification are listed in Table 3-1.

At this early stage, a functional description of what is to be accomplished is created along with some of the top-level circuit requirements.

Array Interfacing

For the partitioned project (multiple arrays), the individual array specifications would include a description of array interfacing.

Interconnection between arrays is faster when done with ECL. When choosing single or dual (differential) rail ECL use the following guidelines:

• If the arrays will be placed on the same board and will be adjacent to each other, single rail (non-differential) ECL may be acceptable.
• If the arrays will communicate across a backplane or be remote on the board, differential ECL may be required.
• Differential ECL is required if the operating speeds exceed the maximum frequency specifications for single rail ECL.

The potential need for differential ECL should be indicated at the functional specifica tion level.

Partitioned circuits should attempt to balance the distribution of I/O and internal cell usage between the different arrays while maintaining critical paths within one array if possible. This is still the rule to follow - no matter how big the arrays get.

It is also a good guideline for how to break up a 6-8 milllion gate array into top-level blocks - keep the critical paths inside the block if possible. Interblock connections today are what interarray connections were yesterday.

In today's very large designs (1 - 12 million equivalent gates, the blocks within the design (250K to 500K equivalent gates or what can be run overnight with Design Compiler) fall under the same rules as multiple-arrays did. The same care in partitioning the I/O (in this case the block interconnect), the grouping of the logic by function and to maintain the best options for the critical paths, and consideration of the external I/O ring requirements are still the rules.

Table 3-1 Components of The Functional specification

Functional Specification
Block diagram to the module level- including any partitioning into more than one array
Description of the boundaries between the modules and the rest of the system
Initial sizing of the I/O interface by type - ECL, TTL, etc.
Functional Description of the Modules
Description of the interface between the circuit modules - busses, control, critical interconnects
The overall performance requirements
- - - the maximum frequency of operation
- - - target clock speed (per clock)
- - - path propagation delay requirements set by modules external to this design
I/O toggle rates
Synchronous/asynchronous signals
Allowed or available power supplies
Power restrictions
Physical size restrictions
Environmental requirements -Commercial, Military, Industrial, Other
Packaging requirements
Derating for junction temperature
Prioritized design objectives

Hard Specifications

Design criteria that are considered as hard (inflexible) specifications should be clearly documented as such. Specifications that might be alterable should also be clearly identified. If a tradeoff or judgment call needs to be made during the remainder of the design project, such information can save time and possibly the project.

Design Objectives

Overall design objectives should be clearly identified and documented. These include optimization for speed, power or die size, which translates to minimized inter nal cell utilization and minimized I/O utilization. Since these objectives are in conflict, they should be prioritized.

As a last step, there should be a careful design review of the circuit and system functional specifications, and the partitioning.

Copyright © 1996, 2001, 2002, 2008, 2016 Donnamaie E. White , WhitePubs Enterprises, Inc.
For problems or questions on these pages, contact [email protected]